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HI5675
Data Sheet April 1999 File Number 4711
8-Bit, 20MSPS, Flash A/D Converter
The HI5675 is an 8-bit, analog-to-digital converter built in an advanced CMOS process. The low power, low differential gain and phase, high sampling rate, and single 5V supply make the HI5675 ideal for video and imaging applications. The adoption of a 2-step flash architecture achieves low power consumption (60mW) at a maximum conversion speed of 20MSPS with only a 2.5 clock cycle data latency. The HI5675 also features digital output enable/disable and a built in voltage reference. The HI5675 can be configured to use the internal reference or an external reference if higher precision is required.
Features
* Resolution . . . . . . . . . . . . . . . . . . . . 8-Bit 0.3 LSB (DNL) * Maximum Sampling Frequency . . . . . . . . . . . . . .20MSPS * Low Power Consumption . . . . . . . . . . . . . . . . . . . . .60mW (Reference Current Excluded) * Built-In Sample and Hold Circuit * Built-In Reference Voltage Self Bias Circuit * Three-State TTL Compatible Output * Single +5V Power Supply * Low Input Capacitance . . . . . . . . . . . . . . . . . . . 11pF (Typ) * Reference Impedance . . . . . . . . . . . . . . . . . . . 300 (Typ) * Low Cost
Ordering Information
PART NUMBER HI5675JCB TEMP. RANGE (oC) -40 to 85 PACKAGE 24 Ld SOIC PKG. NO. M24.2-S
* Direct Replacement for TLC5510 and ADC1175
Applications Pinout
HI5675 (SOIC) TOP VIEW
OE DVSS D0 (LSB) D1 D2 D3 D4 D5 D6 D7 (MSB) DVDD CLK 1 2 3 4 5 6 7 8 9 10 11 12 24 DVSS 23 VRB 22 VRBS 21 AVSS 20 AVSS 19 VIN 18 AVDD 17 VRT 16 VRTS 15 AVDD 14 AVDD 13 DVDD
* Video Digitizing * PC Video Capture * Image Scanners * TV Set Top Boxes * Multimedia * Personal Communication Systems (PCS)
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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright (c) Intersil Corporation 1999
HI5675 Functional Block Diagram
OE DVSS D0 (LSB) D1 D2 D3 D4 D5 D6 1 2 3 4 5 6 7 8 9 UPPER DATA LATCHES LOWER DATA LATCHES LOWER ENCODER (4-BIT) LOWER COMPARATORS WITH S/H (4-BIT) REFERENCE VOLTAGE 24 DVSS 23 VRB 22 VRBS 0.6V (Typ)
21 AVSS 20 AVSS
LOWER ENCODER (4-BIT)
LOWER COMPARATORS WITH S/H (4-BIT)
19 VIN 18 AVDD 17 VRT
D7 (MSB) 10 DVDD 11 CLK 12 CLOCK GENERATOR
UPPER ENCODER (4-BIT)
UPPER COMPARATORS WITH S/H (4-BIT)
16
VRTS 2.6V (Typ)
15 AVDD 14 AVDD 13 DVDD
Typical Application Schematic
HC04 CA158A R4 + +5V C9 + 4.7F C10 0.1F R5 + 13 14 15 CA158A C12 0.1F HA2544 VIN + C8 16 17 18 12 11 10 9 8 7 HI5675 19 20 R1 R2 21 22 23 C11 0.1F C7 + 4.7F +5V 24 6 5 4 3 2 1 D3 D2 D1 D0 (LSB) D7 (MSB) D6 D5 D4 CLOCK IN CLK
+5V
R11 R3
R13
ICL8069
R12
-
-
: Ceramic Chip Capacitor 0.1F : Analog GND : Digital GND
NOTE: It is necessary that AVDD and DVDD pins be driven from the same supply. The gain of analog input signal can be changed by adjusting the ratio of R2 to R1.
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HI5675 Pin Descriptions
PIN NUMBER 1 2, 24 3-10 11, 13 12 16 17 23 14, 15, 18 19 20, 21 22 SYMBOL OE DVSS D0 to D7 DVDD CLK VRTS VRT VRB AVDD VIN AVSS VRBS DESCRIPTION When OE = Low, Data is valid. When OE = High, D0 to D7 pins high impedance. Digital GND. D0 (LSB) to D7 (MSB) Output. Digital +5V. (Connect to AVDD to avoid Latchup). Clock Input. Shorted with VRT generates, +2.6V. Reference Voltage (Top). Reference Voltage (Bottom). Analog +5V. Digital +5V. (Connect to DVDD to avoid Latchup). Analog Input. Analog GND. Shorted with VRB generates +0.6V.
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HI5675
Absolute Maximum Ratings
Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7V Reference Voltage, VRT, VRB . . . . . . . . . . . . . . . . . . . . VDD to VSS Analog Input Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . . VDD to VSS Digital Input Voltage, CLK . . . . . . . . . . . . . . . . . . . . . . . VDD to VSS Digital Output Voltage, VOH, VOL. . . . . . . . . . . . . . . . . . VDD to VSS
Thermal Information
Thermal Resistance (Typical, Note 1) JA (oC/W) SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range, TSTG . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only)
Operating Conditions
(Note 1)
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC Supply Voltage AVDD, AVSS , DVDD, DVSS . . . . . . . . . . . . . . . . +4.75V to +5.25V |DGND-AGND|. . . . . . . . . . . . . . . . . . . . . . . . . . . . 0mV to 100mV Reference Input Voltage VRB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V and Above VRT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.8V and Below Analog Input Range, VIN . . . . . . . VRB to VRT (1.8VP-P to 2.8VP-P) Clock Pulse Width tPW1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25ns (Min) tPW0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25ns (Min)
Die Characteristics
Die Size: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.23 x 2.24mm
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. JA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
PARAMETER SYSTEM PERFORMANCE Offset Voltage EOT EOB Integral Non-Linearity, INL Differential Non-Linearity, DNL DYNAMIC CHARACTERISTICS Effective Number of Bits, ENOB Spurious Free Dynamic Range Signal to Noise Ratio, SINAD RMS Signal = ----------------------------------------------------------------RMS Noise + Distortion Maximum Conversion Speed, fC Minimum Conversion Speed Differential Gain Error, DG Differential Phase Error, DP Aperture Jitter, tAJ Sampling Delay, tDS Data Latency, tLAT ANALOG INPUTS
fC = 20MSPS, AVDD = DVDD = 5V, VRB = 0.5V, VRT = 2.5V, TA = 25oC (Note 1) TEST CONDITIONS MIN TYP MAX UNIT
-60 0 fC = 20MSPS, VIN = 0.6V to 2.6V fC = 20MSPS, VIN = 0.6V to 2.6V -
-35 +15 0.5 0.3
-10 +45 1.3 0.5
mV mV LSB LSB
fIN = 1MHz fIN = 1MHz fC = 20MHz, fIN = 1MHz fC = 20MHz, fIN = 3.58MHz
-
7.6 51 46 46
-
Bits dB dB dB
VIN = 0.6V to 2.6V, fIN = 1kHz Ramp
20 -
1.0 0.5 30 4 -
0.5 2.5
MSPS MSPS % Degree ps ns Cycles
NTSC 40 IRE Mod Ramp, fC = 14.3MSPS
-
Analog Input Bandwidth (-1dB), BW Analog Input Capacitance, CIN VIN = 1.5V + 0.07VRMS
-
18 11
-
MHz pF
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HI5675
Electrical Specifications
PARAMETER REFERENCE INPUT Reference Pin Current, IREF Reference Resistance (VRT to VRB), RREF INTERNAL VOLTAGE REFERENCE Self Bias Mode 1 VRB VRT - VRB Self Bias Mode 2, VRT DIGITAL INPUTS Digital Input Voltage VIH VIL Digital Input Current IIH IIL DIGITAL OUTPUTS Digital Output Current IOH IOL Digital Output Current IOZH IOZL TIMING CHARACTERISTICS Output Data Delay, tDL POWER SUPPLY CHARACTERISTIC Supply Current, IDD NOTE: 2. Electrical specifications guaranteed only under the stated operating conditions. fC = 20MSPS, NTSC Ramp Wave Input 12 17 mA 18 30 ns OE = VDD , VDD = Max VOH = VDD VOL = 0V 0.01 0.01 16 16 A A OE = VSS , VDD = Min VOH = VDD -0.5V VOL = 0.4V -1.1 3.7 mA mA VDD = Max VIH = VDD VIL = 0V 5 5 A A 4.0 1.0 V V VRB = AGND, Short VRT and VRTS Short VRB and VRBS , Short VRT and VRTS 0.60 1.96 2.25 0.64 2.09 2.39 0.68 2.21 2.53 V V V 4.5 230 6.6 300 8.7 450 mA fC = 20MSPS, AVDD = DVDD = 5V, VRB = 0.5V, VRT = 2.5V, TA = 25oC (Note 1) (Continued) TEST CONDITIONS MIN TYP MAX UNIT
Timing Diagrams
tPW1 tPW0
CLOCK ANALOG INPUT
N
N+1
N-2 N-1
N+3 N
N+4 N+1
DATA OUTPUT
N-3
N-2
: POINT FOR ANALOG SIGNAL SAMPLING
tD = 18ns
FIGURE 1.
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HI5675 Timing Diagrams
(Continued)
VI (1) VI (2) VI (3) VI (4)
ANALOG INPUT
EXTERNAL CLOCK
UPPER COMPARATOR BLOCK
S (1)
C (1)
S (2)
C (2)
S (3)
C (3)
S (4)
C (4)
UPPER DATA
MD (0)
MD (1)
MD (2)
MD (3)
LOWER REFERENCE VOLTAGE
RV (0)
RV (1)
RV (2)
RV (3)
LOWER COMPARATOR BLOCK A
S (1)
H (1)
C (1)
S (3)
H (3)
C (3)
LOWER DATA A
LD (-1)
LD (1)
LOWER COMPARATOR BLOCK B
H (0)
C (0)
S (2)
H (2)
C (2)
S (4)
H (4)
LOWER DATA B
LD (-2)
LD (0)
LD (2)
DIGITAL OUTPUT
OUT (-2)
OUT (-1)
OUT (0)
OUT (1)
FIGURE 2.
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HI5675
TABLE 1. A/D OUTPUT CODE TABLE INPUT SIGNAL VOLTAGE VRT * * * * * * * * DIGITAL OUTPUT CODE STEP 255 * * * 128 127 * * * 0 0 0 0 0 1 0 0 1 0 1 0 1 MSB 1 D6 1 D5 1 D4 1 D3 1 * * * 0 1 * * * 0 0 0 0 0 1 0 1 0 1 D2 1 D1 1 LSB 1
VRB
Detailed Description
The HI5675 is a 2-step A/D converter featuring a 4-bit upper comparator group and two lower comparator groups of 4 bits each. The reference voltage can be obtained from the onboard bias generator or be supplied externally. This IC uses an offset canceling type comparator that operates synchronously with an external clock. The operating modes of the part are input sampling (S), hold (H), and compare (C). The operation of the part is illustrated in Figure 2. A reference voltage that is between VRT -VRB is constantly applied to the upper 4-bit comparator group. VI(1) is sampled with the falling edge of the first clock by the upper comparator block. The lower block A also samples VI(1) on the same edge. The upper comparator block finalizes comparison data MD(1) with the rising edge of the first clock. Simultaneously the reference supply generates a reference voltage RV(1) that corresponds to the upper results and applies it to the lower comparator block A. The lower comparator block finalizes comparison data LD(1) with the rising edge of the second clock. MD(1) and LD(1) are combined and output as OUT(1) with the rising edge of the third clock. There is a 2.5 cycle clock delay from the analog input sampling point to the corresponding digital output data. Notice how the lower comparator blocks A and B alternate generating the lower data in order to increase the overall A/D sampling rate.
Analog Input
The input capacitance is small when compared with other flash type A/D converters. However, it is necessary to drive the input with an amplifier with sufficient bandwidth and drive capability. In order to prevent parasitic oscillation, it may be necessary to insert a low value (i.e., 0.24) resistor between the output of the amplifier and the A/D input.
Reference Input
The range of the A/D is set by the voltage between VRT and VRB . The internal bias generator will set VRTS to 2.6V and VRBS to 0.6V. These can be used as the part reference by shorting VRT and VRTS and VRB to VRBS . The analog input range of the A/D will now be from 0.6V to 2.6V and is referred to as Self Bias Mode 1. Self Bias Mode 2 is where VRB is connected to AGND and VRT is shorted to VRTS . The analog input range will now be from 0V to 2.4V.
Power, Grounding, and Decoupling
To reduce noise effects, separate the analog and digital grounds. In order to avoid latchup at power up, it is necessary that AVDD and DVDD be driven from the same supply. Bypass both the digital and analog VDD pins to their respective grounds with a ceramic 0.1F capacitor close to the pin.
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HI5675 Test Circuits
+V S1: ON IF A < B S2: ON IF A > B
S2
+ S1
AHI5675 8
A>B 8
COMPARATOR A8 TO A1 A0 B8 TO B1 B0 BUFFER
"0" DVM CLK (20MHz)
"1" 8 000 * * * 00 TO 111 * * * 10
CONTROLLER
FIGURE 3. INTEGRAL AND DIFFERENTIAL NON-LINEARITY ERROR AND OFFSET VOLTAGE TEST CIRCUIT
2.6V fC -1kHz SG 0.6V 1 2 NTSC SIGNAL SOURCE 40 IRE MODULATION BURST 0.6V TTL ECL -5.2V AMP VIN DUT HI5675 8 TTL ECL 620 2.6V -5.2V 620 SYNC DG DP 8 HI20201 1 10-BIT D/A CLK 2 VECTOR SCOPE HPF
ERROR RATE
COUNTER
100
IRE 0 -40 SG (CW) fC
FIGURE 4. MAXIMUM OPERATIONAL SPEED AND DIFFERENTIAL GAIN AND PHASE ERROR TEST CIRCUIT
2.6V 0.6V
VDD VRT VIN VRB HI5675 CLK OE VOL GND
2.6V IOL 0.6V
VDD VRT VIN VRB HI5675 CLK OE VOH GND
IOH
+
+
-
-
FIGURE 5. DIGITAL OUTPUT CURRENT TEST CIRCUIT
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HI5675 Static Performance Definitions
Offset, full scale, and gain all use a measured value of the internal voltage reference to determine the ideal plus and minus full scale values. The results are all displayed in LSBs.
Total Harmonic Distortion
This is the ratio of the RMS sum of the first 5 harmonic components to the RMS value of the measured input signal.
Offset Error (EOB)
The first code transition should occur at a level 1/2 LSB above the bottom reference voltage. Offset is defined as the deviation of the actual code transition from this point. Note that this is adjustable to zero.
2nd and 3rd Harmonic Distortion
This is the ratio of the RMS value of the 2nd and 3rd harmonic component respectively to the RMS value of the measured input signal.
Full Scale Error (EOT)
The last code transition should occur for a analog input that is 11/2 LSBs below full scale. Full scale error is defined as the deviation of the actual code transition from this point.
Spurious Free Dynamic Range (SFDR)
SFDR is the ratio of the fundamental RMS amplitude to the RMS amplitude of the next largest spur or spectral component. If the harmonics are buried in the noise floor it is the largest peak.
Differential Linearity Error (DNL)
DNL is the worst case deviation of a code width from the ideal value of 1 LSB. The converter is guaranteed to have no missing codes.
Full Power Input Bandwidth
Full power bandwidth is the frequency at which the amplitude of the digitally reconstructed output has decreased 3dB below the amplitude of the input sine wave. The input sine wave has a peak-to-peak amplitude equal to the reference voltage. The bandwidth given is measured at the specified sampling frequency.
Integral Linearity Error (INL)
INL is the worst case deviation of a code center from a best fit straight line calculated from the measured data.
Dynamic Performance Definitions
Fast Fourier Transform (FFT) techniques are used to evaluate the dynamic performance of the HI5675. A low distortion sine wave is applied to the input, it is sampled, and the output is stored in RAM. The data is then transformed into the frequency domain with a 1024 point FFT and analyzed to evaluate the dynamic performance of the A/D. The sine wave input to the part is -0.5dB down from fullscale for all these tests. The distortion numbers are quoted in dBc (decibels with respect to carrier) and DO NOT include any correction factors for normalizing to fullscale.
Timing Definitions
Sampling Delay (tSD)
Sampling delay is the time delay between the external sample command (the falling edge of the clock) and the time at which the signal is actually sampled. This delay is due to internal clock path propagation delays.
Aperture Jitter (tAJ)
This is the RMS variation in the sampling delay due to variation of internal clock path delays.
Signal-to-Noise Ratio (SNR)
SNR is the measured RMS signal to RMS noise at a specified input and sampling frequency. The noise is the RMS sum of all of the spectral components except the fundamental and the first five harmonics.
Data Latency (tLAT)
After the analog sample is taken, the data on the bus is available after 2.5 cycles of the clock. This is due to the architecture of the converter where the data has to ripple through the stages. This delay is specified as the data latency. After the data latency time, the data representing each succeeding sample is output at the following clock pulse. The digital data lags the analog input by 2.5 cycles.
Signal-to-Noise + Distortion Ratio (SINAD)
SINAD is the measured RMS signal to RMS sum of all other spectral components below the Nyquist frequency excluding DC.
Output Data Delay (tD)
Output Data Delay is the delay time from when the data is valid (rising clock edge) to when it shows up at the output bus. This is due to internal delays at the digital output.
Effective Number Of Bits (ENOB)
The effective number of bits (ENOB) is derived from the SINAD data. ENOB is calculated from: ENOB = (SINAD - 1.76 + VCORR) / 6.02, where: VCORR = 0.5dB.
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HI5675 Small Outline Plastic Packages (SOIC)
N INDEX AREA H E
M24.2-S
24 LEAD SMALL OUTLINE PLASTIC PACKAGE (200 MIL) INCHES SYMBOL A MIN 0.067 0.002 0.014 0.006 0.587 0.205 MAX 0.088 0.011 0.021 0.011 0.606 0.220 MILLIMETERS MIN 1.70 0.05 0.35 0.15 14.9 5.2 MAX 2.25 0.30 0.55 0.30 15.4 5.6 NOTES 1 2 3 4 10o Rev. 1 4/95
1
2
3 SEATING PLANE D A
A1
L
B C D E
e
B 0.24 M A1 0.15(0.006) C
e H L N
0.050 BSC 0.296 0.012 24 0o 10o 0.326 0.027
1.27 BSC 7.5 0.30 24 0o 8.3 0.70
NOTES: 1. Dimension "D" does not include mold flash, protrusions or gate burrs. 2. Dimension "E" does not include interlead flash or protrusions. 3. "L" is the length of terminal for soldering to a substrate. 4. "N" is the number of terminal positions. 5. Terminal numbers are shown for reference only. 6. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029
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